JPH0356339Y2 - - Google Patents

Info

Publication number
JPH0356339Y2
JPH0356339Y2 JP4604287U JP4604287U JPH0356339Y2 JP H0356339 Y2 JPH0356339 Y2 JP H0356339Y2 JP 4604287 U JP4604287 U JP 4604287U JP 4604287 U JP4604287 U JP 4604287U JP H0356339 Y2 JPH0356339 Y2 JP H0356339Y2
Authority
JP
Japan
Prior art keywords
cavity
mold
resin
gate
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4604287U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63151815U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4604287U priority Critical patent/JPH0356339Y2/ja
Publication of JPS63151815U publication Critical patent/JPS63151815U/ja
Application granted granted Critical
Publication of JPH0356339Y2 publication Critical patent/JPH0356339Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP4604287U 1987-03-27 1987-03-27 Expired JPH0356339Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4604287U JPH0356339Y2 (en]) 1987-03-27 1987-03-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4604287U JPH0356339Y2 (en]) 1987-03-27 1987-03-27

Publications (2)

Publication Number Publication Date
JPS63151815U JPS63151815U (en]) 1988-10-05
JPH0356339Y2 true JPH0356339Y2 (en]) 1991-12-18

Family

ID=30865336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4604287U Expired JPH0356339Y2 (en]) 1987-03-27 1987-03-27

Country Status (1)

Country Link
JP (1) JPH0356339Y2 (en])

Also Published As

Publication number Publication date
JPS63151815U (en]) 1988-10-05

Similar Documents

Publication Publication Date Title
JP2526787B2 (ja) 半導体装置用リ―ドフレ―ム
JPS57147260A (en) Manufacture of resin-sealed semiconductor device and lead frame used therefor
KR920022432A (ko) 반도체 장치 및 수지 봉지 반도체 디바이스의 제조방법
JPH0356339Y2 (en])
JPH01161736A (ja) 半導体装置用パッケージ
JPS6240851B2 (en])
JP2525555Y2 (ja) 樹脂封止型半導体装置用リードフレーム組立体
EP0130552B1 (en) Electronic device method using a leadframe with an integral mold vent means
JPH03222464A (ja) 半導体装置及びその製造方法
JPH01232733A (ja) 半導体樹脂封止装置
US5897883A (en) Mold having projections for inhibiting the formation of air pockets
JPS6197955A (ja) リ−ドフレ−ム
JPS6034268B2 (ja) Ic用リ−ドフレ−ム
JPS61144033A (ja) 半導体装置の樹脂封止成形方法
JPS638130Y2 (en])
JPH0587962U (ja) リードフレーム
KR100458644B1 (ko) 리드프레임 도금장치
JPS5889844A (ja) 樹脂封止型半導体装置
JPS5854659A (ja) 樹脂封止型半導体装置
JPH02191365A (ja) 半導体装置およびその製造方法
JPS63162208A (ja) 成形装置
JPH0356340Y2 (en])
JPS55108755A (en) Resin seal type semiconductor device
JPH0621309A (ja) リードフレーム
JPS61193460A (ja) 樹脂封止型半導体装置の製造方法